![]() However, Zn anodes suffer from the dendrite formation and side reactions during the plating/stripping process, which severely hinder their practical applications. This work opens a new avenue to develop advanced three-dimensional Zn metal anodes for high-performance rechargeable aqueous batteries.Ībstract = "Metallic zinc (Zn), featuring high specific capacity, low redox potential, and low cost, is a promising anode material for next-generation rechargeable aqueous batteries. By contrast, the capacity of the cell with the anode decays to 55.2 mAh g −1 after 800 cycles, corresponding to a retention rate of 38.1%. Moreover, the anode enables the Zn-MnO 2 full cell to deliver a high capacity of 164 mAh g −1 and maintain a retention rate of 86.2% after 1200 cycles at 1 A g −1. The cell with the pristine Cu mesh host (PCH), in comparison, exhibits a CE of 97.7% and suffers from short-circuits after 50 cycles. As a result, the asymmetric Zn||NSH cell achieves a coulombic efficiency (CE) of 99.0% for over 200 cycles at 2 mA cm −2. Both experimental and numerical results reveal that the newly developed NSH offers abundant Zn nucleation sites, homogenizes both the ion flux and electric field at the electrode surface, and suppresses side reactions with the high hydrogen evolution reaction overpotential of Sn, thus leading to dendrite-free Zn deposition and a highly reversible plating/stripping process. To simultaneously address these issues, we create a hierarchical porous framework by electroless plating a conformal nanoporous tin (Sn) layer on a copper (Cu) mesh as a host (NSH) for the Zn anode. The need to mitigate tin whisker growth and their methods are discussed next.Metallic zinc (Zn), featuring high specific capacity, low redox potential, and low cost, is a promising anode material for next-generation rechargeable aqueous batteries. This article explores the causes of tin whiskers in PCBs, and their adverse effects on the performance of high-reliability electronics. ![]() Both these conditions may cause a temporary or permanent failure in the electronics assembly. The conductive nature of the tin whiskers creates current leakage risk and, in the extreme case, a short circuit. A tin whisker is able to bridge the gap between the terminals of components in modern miniaturized PCBs. However, the use of pure tin causes a serious reliability issue in electronics in the form of tin whiskers. Solder material has particularly undergone a complete shift from lead to other metals and their alloys.Īmong all the possible replacements for lead, tin is considered the predominant choice for solder alloys.
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